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Loxon H1 One Component Low Modulus Hybrid Sealant

Loxon® H1 is a one component, low modulus, high performance, high movement, fast-curing, non-sag, gun-grade, moisture cure, hybrid sealant. It is designed for a wide range of sealing and caulking applications. After curing, Loxon H1 exhibits a flexible, resilient, rubber-like appearance that adheres to a wide variety of substrates. The combination of extreme flexibility (ASTM C920 Class 50) and very low modulus make this sealant excellent for properly constructed EIFS substrates.

 

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